Advanced packaging scales chips per package on any node

Putting more dies per package (Blackwell's two, Rubin Ultra's four, Tesla's wafer-scale Dojo with 25, Huawei Ascend's progression) is a path to higher in-package bandwidth that works on older nodes too; Huawei leans on packaging scaling because it can't shrink process, and anything done on 7nm packaging can also be done on 3nm.